JPH0372691B2 - - Google Patents
Info
- Publication number
- JPH0372691B2 JPH0372691B2 JP59101723A JP10172384A JPH0372691B2 JP H0372691 B2 JPH0372691 B2 JP H0372691B2 JP 59101723 A JP59101723 A JP 59101723A JP 10172384 A JP10172384 A JP 10172384A JP H0372691 B2 JPH0372691 B2 JP H0372691B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- content
- alloy
- properties
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59101723A JPS60245753A (ja) | 1984-05-22 | 1984-05-22 | 高力高導電銅合金 |
US06/844,237 US4666667A (en) | 1984-05-22 | 1986-03-25 | High-strength, high-conductivity copper alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59101723A JPS60245753A (ja) | 1984-05-22 | 1984-05-22 | 高力高導電銅合金 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17588887A Division JPS63125633A (ja) | 1987-07-16 | 1987-07-16 | 高力高導電銅合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60245753A JPS60245753A (ja) | 1985-12-05 |
JPH0372691B2 true JPH0372691B2 (en]) | 1991-11-19 |
Family
ID=14308215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59101723A Granted JPS60245753A (ja) | 1984-05-22 | 1984-05-22 | 高力高導電銅合金 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4666667A (en]) |
JP (1) | JPS60245753A (en]) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61127840A (ja) * | 1984-11-27 | 1986-06-16 | Nippon Mining Co Ltd | 高力高導電銅合金 |
JPS62156242A (ja) * | 1985-12-27 | 1987-07-11 | Mitsubishi Electric Corp | 銅基合金 |
IT1196620B (it) * | 1986-09-11 | 1988-11-16 | Metalli Ind Spa | Lega metallica a base di rame di tipo perfezionato,particolarmente per la costruzione di componenti elettronici |
JPS63161135A (ja) * | 1986-12-23 | 1988-07-04 | Mitsui Mining & Smelting Co Ltd | 電気部品用銅合金 |
JPH01119635A (ja) * | 1987-10-30 | 1989-05-11 | Ngk Insulators Ltd | 導電ばね材料 |
US4950451A (en) * | 1988-03-23 | 1990-08-21 | Mitsubishi Denki Kabushiki Kaisha | Copper alloy for an electronic device and method of preparing the same |
JPH01316432A (ja) * | 1988-06-16 | 1989-12-21 | Dowa Mining Co Ltd | ハンダ耐候性にすぐれた導電材料用銅合金 |
JPH0765133B2 (ja) * | 1988-10-17 | 1995-07-12 | 日立粉末冶金株式会社 | 耐摩耗性銅系焼結含油軸受材料 |
US5719447A (en) * | 1993-06-03 | 1998-02-17 | Intel Corporation | Metal alloy interconnections for integrated circuits |
US5882442A (en) * | 1995-10-20 | 1999-03-16 | Olin Corporation | Iron modified phosphor-bronze |
US5795619A (en) * | 1995-12-13 | 1998-08-18 | National Science Council | Solder bump fabricated method incorporate with electroless deposit and dip solder |
US5820701A (en) * | 1996-11-07 | 1998-10-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
US5865910A (en) * | 1996-11-07 | 1999-02-02 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
US6132528A (en) * | 1997-04-18 | 2000-10-17 | Olin Corporation | Iron modified tin brass |
US5853505A (en) * | 1997-04-18 | 1998-12-29 | Olin Corporation | Iron modified tin brass |
US6679956B2 (en) | 1997-09-16 | 2004-01-20 | Waterbury Rolling Mills, Inc. | Process for making copper-tin-zinc alloys |
US5893953A (en) * | 1997-09-16 | 1999-04-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
US6471792B1 (en) | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
US6436206B1 (en) | 1999-04-01 | 2002-08-20 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
JP2001032029A (ja) * | 1999-05-20 | 2001-02-06 | Kobe Steel Ltd | 耐応力緩和特性に優れた銅合金及びその製造方法 |
DE60324711D1 (en]) | 2003-03-03 | 2008-12-24 | Mitsubishi Shindo Kk | |
WO2009019990A1 (ja) * | 2007-08-07 | 2009-02-12 | Kabushiki Kaisha Kobe Seiko Sho | 銅合金板 |
US8986471B2 (en) | 2007-12-21 | 2015-03-24 | Mitsubishi Shindoh Co., Ltd. | High strength and high thermal conductivity copper alloy tube and method for producing the same |
CN101932741B (zh) | 2008-02-26 | 2012-10-24 | 三菱伸铜株式会社 | 高强度高导电铜棒线材 |
CN101960028B (zh) * | 2008-03-28 | 2013-03-13 | 三菱伸铜株式会社 | 高强度高导电铜合金管/棒/线材 |
US9455058B2 (en) | 2009-01-09 | 2016-09-27 | Mitsubishi Shindoh Co., Ltd. | High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same |
KR101174596B1 (ko) | 2009-01-09 | 2012-08-16 | 미쓰비시 신도 가부시키가이샤 | 고강도 고도전 구리합금 압연판 및 그 제조방법 |
DE102013014500A1 (de) * | 2013-09-02 | 2015-03-05 | Kme Germany Gmbh & Co. Kg | Kupferlegierung |
RU2618955C1 (ru) * | 2016-07-11 | 2017-05-11 | Юлия Алексеевна Щепочкина | Сплав на основе меди |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55115935A (en) * | 1979-02-28 | 1980-09-06 | Mitsubishi Electric Corp | Melting method for work hardening type copper alloy |
JPS5834537B2 (ja) * | 1980-06-16 | 1983-07-27 | 日本鉱業株式会社 | 耐熱性の良好な高力導電用銅合金 |
JPS5836058B2 (ja) * | 1980-08-20 | 1983-08-06 | 日本鉱業株式会社 | 耐熱性のすぐれた高力導電用銅合金 |
JPS5853700B2 (ja) * | 1981-04-09 | 1983-11-30 | 日本鉱業株式会社 | 半導体機器のリ−ド材用銅合金 |
JPS5816044A (ja) * | 1981-07-23 | 1983-01-29 | Mitsubishi Electric Corp | 銅基合金 |
JPS5839142A (ja) * | 1981-09-02 | 1983-03-07 | Nec Corp | 手動入力装置 |
JPS5959850A (ja) * | 1982-09-29 | 1984-04-05 | Hitachi Metals Ltd | リ−ドフレ−ム合金 |
JPS6039142A (ja) * | 1983-08-11 | 1985-02-28 | Mitsubishi Electric Corp | 銅基合金 |
JPS60112813A (ja) * | 1983-11-24 | 1985-06-19 | Dainippon Ink & Chem Inc | 成形材料用エポキシ樹脂組成物 |
MX159669A (es) * | 1983-12-12 | 1989-08-02 | Ciba Geigy Ag | Procedimiento para la preparacion de derivados de acilamida |
JPS60131939A (ja) * | 1983-12-19 | 1985-07-13 | Furukawa Electric Co Ltd:The | リ−ドフレ−ム用銅合金 |
-
1984
- 1984-05-22 JP JP59101723A patent/JPS60245753A/ja active Granted
-
1986
- 1986-03-25 US US06/844,237 patent/US4666667A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS60245753A (ja) | 1985-12-05 |
US4666667A (en) | 1987-05-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |